qianli 3in1 bga reballing stencil for iphone cpu a8 a9 a10 a11 a12 a13 a14 planting tin solder template 0 12mm thickness
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1. Line thickness and softness moderate size, easy to bend but not easy to tie entwined 2. Good flexibility, elasticity, resistant dirt, abrasion resistance and shielding strong 3. Data transmission is more stable, reducing the radiation 4. Compatible with USB 2.0 / 3.0 device 5. Compact and lightweight, it is a good size for travel 6. Manufactured with environmentally friendly materials, durable to use